SaleSold outPaperback
Fundamentals And Applications Of Renewable Energy
₹850 ₹765
Save: 10%
Human Computer Interaction
₹799 ₹719
Save: 10%
Fundamentals of Device and Systems Packaging
Publisher:
McGraw Hill
| Author:
Rao R. Tummala
| Language:
English
| Format:
Paperback
Publisher:
McGraw Hill
Author:
Rao R. Tummala
Language:
English
Format:
Paperback
₹1,599 ₹1,359
Save: 15%
Out of stock
Receive in-stock notifications for this.
Ships within:
3-5 Days
Out of stock
ISBN:
SKU
9789390385515
Category Computer Engineering/IT Engineering
Category: Computer Engineering/IT Engineering
Page Extent:
848
Fundamentals of device and systems packaging: technologies and applications, second edition introduces the concept of moore’s law for packaging, as moore’s law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s law for packaging (mlp) can be viewed as interconnecting and integrating many smaller chips with high Aggregate transistor density, at higher performance and lower cost than moore’s law for ICs. This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. Readers will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and emi; thermal design by conduction, Convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and mesoscale; ceramic, Organic, glass, and Silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with activities; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronic; MEMS and sensor packaging; encapsulation, moulding and sealing; and printed Wiring Board and its assembly to form end-product systems.
Be the first to review “Fundamentals of Device and Systems Packaging” Cancel reply
Description
Fundamentals of device and systems packaging: technologies and applications, second edition introduces the concept of moore’s law for packaging, as moore’s law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s law for packaging (mlp) can be viewed as interconnecting and integrating many smaller chips with high Aggregate transistor density, at higher performance and lower cost than moore’s law for ICs. This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. Readers will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and emi; thermal design by conduction, Convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and mesoscale; ceramic, Organic, glass, and Silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with activities; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronic; MEMS and sensor packaging; encapsulation, moulding and sealing; and printed Wiring Board and its assembly to form end-product systems.
About Author
Dr. Rao Tummala is a chair professor and director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of all three volumes of Microelectronics Packaging Handbook, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. Dr. Tummala was a longtime packaging technologist and IBM Fellow at IBM.
Reviews
There are no reviews yet.
Be the first to review “Fundamentals of Device and Systems Packaging” Cancel reply
[wt-related-products product_id="test001"]
Related products
RELATED PRODUCTS
Computer Methods For Engineering With Matlab Applications, 2nd Edn
Save: 15%
Digital Forensics In The Era Of Artificial Intelligence
Save: 15%
Driving 5g Mobile Communications With Artificial Intelligence Towards 6g
Save: 15%
Introduction To Programming And Problem-Solving Scala, 2nd Edition
Save: 15%
Machine Learning For Healthcare , Handling And Managing Data
Save: 15%
Secure Data Science Integrating Cyber Security And Data Science
Save: 15%
Security And Organization Within Iot And Smart Cities
Save: 15%
Sensors Cloud And Fog , The Enabling Technologies For The Internet Of Things
Save: 15%
Reviews
There are no reviews yet.